Thermal Conductivity Device
Product Code: LM.PLUS
Categories:
Determining the Steady-State Heat Flow Characteristics of Flat Plate Heat Samples
EPS, XPS, PUR, mineral wool, VIPs, sandwich panels, etc. materials are used to determine the steady-state heat flow characteristics, thermal conductivity, and thermal resistance of flat plate heat samples. These procedures are carried out in accordance with EN 12667, ASTM C518, ISO 8301 standards.
LM.PLUS 305 Technical Specifications
- Max. sample thickness: 100 mm
- Sample length and width: min. 300 mm, max. unlimited
- Temperature difference between plates: max. 50 °C, preset at 10 °C
- Upper plate temperature: preset at 15 °C, adjustable between 5 °C and 45 °C
- Lower plate temperature: preset at 5 °C, adjustable between -5 °C and +35 °C
LM.PLUS 505 Technical Specifications
- Max. sample thickness: 150 mm
- Sample length and width: min. 500 mm, max. unlimited
- Temperature difference between plates: max. 50 °C, preset at 10 °C
- Upper plate temperature: preset at 15 °C, adjustable between 5 °C and 45 °C
- Lower plate temperature: preset at 5 °C, adjustable between -5 °C and +35 °C
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