Thermal Conductivity Device

Product Code: HFM.6200

Thermal Conductivity Device
Categories:
Heat Insulation Materials

EPS, XPS, PUR, mineral wool, VIPs, sandwich panels and other materials are used to determine the steady-state heat flow properties, thermal conductivity, and thermal resistance of flat plate heat samples.

Tests conducted in accordance with EN 12667, ASTM C518 and ISO 8301 standards are performed with the following HFM.6200 device:

HFM.6200 Technical Specifications

  • Max. sample thickness: 200 mm
  • Sample length and width: 600 mm, max. unlimited
  • Temperature difference between plates: max. 50°C, preset at 10°C
  • Upper plate temperature: adjustable between 10°C and 50°C, preset at 15°C
  • Lower plate temperature: adjustable between 0°C and 40°C, preset at 5°C

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